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Veridiam Point Technologies, S.A., introduces
a new, ultra-thin coating technology that
provides a protective insulation barrier on
probe needle surfaces.
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Veridiam Point Technologies Engineers New Ultra-thin Probe Needle
Coating Technology; Advancing Small Pitch Probe Design,
Manufacturing and Quality Benefits
El Coyol, Alajuela, Costa Rica -- VERIDIAM POINT TECHNOLOGIES, S.A., a leading manufacturer of probe needles used for semiconductor wafer testing, introduces a new, ultra-thin coating technology that provides a protective insulation barrier on probe needle surfaces. This coating replaces the thick plastic tubes that are currently used.
Veridiam Point Technologies' ultra-thin insulating coating provides several distinct advantages over conventional insulated tube-type needles. First, it provides both an insulating as well as a protective coating to probe needle surfaces. The coating formulation provides excellent electrical insulation, superior strength, stable properties over a wide temperature range and protection from cleaning solvents and solder fluxes. It can be applied in an extremely thin layer of 0.1- 0.2 mil (0.0001-0.0002 inch or 0.0025-0.0050 millimeter). This advantage allows closer placement of probe needles and opens applications to smaller pitch and higher density probe card designs.
All of Veridiam Point Technologies' coating advantages add up to time and cost savings. Quality is also enhanced by eliminating the application of insulated tubes as there is less chance of damage to the probe tip during assembly. "Probe needle accuracy is extremely vital to semiconductor testing," said Marco Bruno, General Manager of Point Technologies. "Our new coating provides the probe needle integrity and durability semiconductor chip manufacturers demand."
Veridiam Point Technologies utilizes a precision, electrochemical pointing process in the manufacture of its probe needles. It provides etching of small diameter wires and achieves extremely tight tolerance tapers with sub-micron points. Its new ultrathin insulating coating process will help customers reach the next performance level in probe card technology and manufacturing quality.
For more information, contact Karol Garro, Veridiam Point Technologies, at (866) 275-1426 (phone) or kgarro@veridiam.com.
ABOUT POINT TECHNOLOGIES
Veridiam Point Technologies, S.A., a Veridiam company, manufacturers probe needles used for semiconductor wafer testing and other critical components. Veridiam Point Technologies, S.A. employs approximately 135 employees in their 20,000 square feet facility in La Aurora de Heredia, Costa Rica. Capabilities include precision wire pointing, swiss screw machining, CNC turning, Multi-axis CNC milling, laser cutting, electroplating, electropolishing, wire EDM and hole-drilling EDM and component assembly. In addition, Point Technologies is also a full service manufacturer of critical metal wire components, subcomponents and assemblies. Point Technologies leads the industry in innovative solutions for electrochemically and mechanically machined products. From raw material to packaged components, Point Technologies controls the entire manufacturing process to ensure the highest quality and competitive prices.
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Veridiam Point Technologies, S.A., introduces a new, ultrathin coating technology that provides a protective insulation barrier on probe needle surfaces.
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